23/02/2026
Meet us at OFC 2026 – Booth #4940
Coherent Transport & AI Datacenter Light Sources
Visit us at OFC 2026 17 – 19 March 2026. Los Angeles Convention Center | Los Angeles, California, United States. To cover high-performance photonic engines designed for the rapid scaling of coherent networks and AI-driven datacenters.
--------------------------------------------
Coherent Transport Solutions
Purpose-built optical sources and amplification for next-generation pluggables, coherent engines, and long-haul/metro networks.
Featured technologies:
⬤ High-Power Gain Chips
Optimized for coherent pluggables, ELS/ITLA architectures, and external cavity lasers. Designed for high optical power, efficiency, and reliability across C & L bands.
⬤ Semiconductor Optical Amplifiers (SOAs)
Wideband amplification for coherent transmitters, boosters, and pre-amps. Enabling higher OSNR, longer reach, and improved system margins.
⬤ Narrow Linewidth Lasers
Ultra-stable sources supporting modulation formats, long-haul transmission, and coherent detection.
Applications:
- 400G / 800G / 1.6T coherent optics
- Metro, long-haul, and subsea networks
- Coherent pluggables & line cards
--------------------------------------------
AI Datacenter & High-Speed Interconnects
Light sources engineered for the explosive growth of AI clusters, hyperscale compute, and high-density optical interconnects.
Featured technologies:
⬤ High-Power DFB Lasers (O-Band & CWDM)
Designed for high-power IMDD and co-packaged optics. Enabling high-density, high-power optical links.
⬤ Fabry-Perot Lasers
Cost-optimized sources for high-volume datacenter optical transceivers and sensing systems.
⬤ SOAs for Optical Engines
Enabling extended reach, improved link budgets, and advanced optical architectures.
Applications:
- 400G / 800G / 1.6T optical transceivers
- Co-packaged optics (CPO)
- Hyperscale datacenter interconnects
- Silicon photonics engines
--------------------------------------------
From Die to Integrated Light Modules
Our vertically integrated InP manufacturing allows us to deliver:
- Wafer → Die → Submount → Module solutions
- Scalable, high-volume manufacturing
- Fast customization and design enablement
- Proven reliability and supply continuity
Let’s discuss how we can power your next coherent and datacenter optical platform at OFC 2026.
https://www.denselight.com/ofc-2026/