Institute of Electrical and Electronics Engineers Phoenix Section

Institute of Electrical and Electronics Engineers Phoenix Section IEEE is the world's largest professional association with over 400,000 members around the world and

IEEE and its members inspire a global community through IEEE's highly cited publications, conferences, technology standards, and professional and educational activities. IEEE creates an environment where members collaborate on world‐changing technologies – from computing and sustainable energy systems, to aerospace, communications, robotics, healthcare, and more. The IEEE Brand Identity Toolkit explains the basic usage rules for all corporate identity elements and how to utilize them to create a powerful and consistent communications pieces.

In Anchorage, Alaska
09/17/2022

In Anchorage, Alaska

It is with profound sadness that we inform you of the passing of our friend, mentor, and esteemed IEEE Senior Member Dr....
12/02/2021

It is with profound sadness that we inform you of the passing of our friend, mentor, and esteemed IEEE Senior Member Dr. Vasudeva (Vasu) Atluri, the evening of Sunday, November 28th. He is survived by his wife, Dr. Satyavathi Atluri.
Vasu was a central figure in Phoenix IEEE community for over three decades. He served as the Section Chair, the Section Award Committee Chair, raised funds and organized the Annual Section Banquet. Vasu also served on many Region 6 and IEEE global committees. He was passionate about IEEE membership, organized many membership drives and participated in Senior Member elevation programs. Vasu was the founding member of the Phoenix Components, Packaging and Manufacturing Technology (CPMT) Society chapter and served on its executive committee for several years. He was also active in the Waves & Devices Society (WAD), Technology and Engineering Management Society (TEMS), the Alliance of IEEE Consultants Networks (AICN) and Engineering for Medicine and Biology Society (EMBS). Vasu was responsible for establishing and expanding the Section's student scholarships, including founding and funding, with his wife, the Atluri Award, for university graduate students.
Vasu was active in the community and supported a variety of university and K-12 student initiatives, including as a judge for the Future City Competition and numerous pre-university science and engineering competitions.
He held technical and people management positions at Motorola Inc., Intel Corporation, Protek Devices, University of Arizona, and Arizona State University. In 2009 he formed Renavitas Technologies, a Scottsdale-based company that designs, constructs, and operates intermediate size solar farms, and manufactures photovoltaic modules. He earned a PhD and MS in Materials Science and Engineering and an MS in Metallurgical Engineering from the University of Arizona and a Bachelor of Technology in Chemical Engineering from Osmania University in India. He had published over 30 papers in technical journals and conference proceedings and held multiple US patents.
His leadership, enthusiasm, selflessness, and dedication to IEEE were inspirational and will be deeply missed. Details of the memorial service will be available shortly.
In lieu of flowers, the family has requested donations in Vasu’s name. Contributions can be made at the link: https://www.ieeefoundation.org/how-to-give/tribute-giving
On the contribution page please follow these instructions:
a) Designation: IEEE Foundation fund
b) Tribute Information: First Name: “Vasu”, Last Name : “Atluri”, Description : Vasu memorial fund
With heavy hearts,
Executive Committee

Welcome to the monthly newsletter Valley Megaphone September 2020 issue! We hope to keep you informed of the exciting ne...
09/09/2020

Welcome to the monthly newsletter Valley Megaphone September 2020 issue! We hope to keep you informed of the exciting news of our section, chapters & affinity groups & students branches.
Please visit http://sites.ieee.org/phoenix/ for more information about the current & upcoming events!

Phoenix IEEE EMC Chapter 2019 Symposium------ Preventing EMC Problems by Design  ------Speaker: Daryl Gerke, PE.  - Kimm...
03/05/2019

Phoenix IEEE EMC Chapter 2019 Symposium

------ Preventing EMC Problems by Design ------

Speaker: Daryl Gerke, PE. - Kimmel Gerke Associates

📅 April 24th, 2019
🌍 Embassy Suites Phoenix, Tempe, Arizona

Terrific opportunity to mix and network with fellow attendees, exhibitors and speakers!

7th Annual Hope Run & STEM Event (Mar. 3)  --- WIEWe support education for children living in our community and around t...
03/05/2019

7th Annual Hope Run & STEM Event (Mar. 3) --- WIE

We support education for children living in our community and around the world. We advocate STEM curriculum choices in school to improve competitiveness in science and technology.

Hmmm, did I just see Superman and Captain America in the crowd? :)

The Phoenix IEEE EMC is hosting the fifth educational EMC Mini-Symposium. This one-day four-part seminar focuses on basi...
03/05/2019

The Phoenix IEEE EMC is hosting the fifth educational EMC Mini-Symposium. This one-day four-part seminar focuses on basic tools, tips, and techniques to achieve EMC compliant designs.

Our speaker, Daryl Gerke, PE, has fifty years of experience in preventing, solving, and teaching about EMI problems.

Date: Wednesday, April 24th, 2019.
Where: Tempe, AZ

10/10/2017

System-in-package (SiP) technology has been evolving through utilization of various package technology building blocks to serve the market needs with respect to miniaturization, higher integration, and smaller form factor, with the added benefits of lower cost and faster time to market as compared t...

10/10/2017

IEEE Electronics Packaging Society (EPS) - Phoenix Chapter
Formerly Known as Components, Packaging and Manufacturing Technology (CPMT) Society

Remember this meeting is on Monday, October 16, 2017, 5:30 PM

System in Package (SiP) Packaging Technology Trends
Vinayak Pandey
VP, Product & Technology Marketing
JCET-Stats ChipPAC Inc.
Tempe, AZ USA
vinayak.pandey@statschippac.com

System-in-package (SiP) technology has been evolving through utilization of various package technology building blocks to serve the market needs with respect to miniaturization, higher integration, and smaller form factor, with the added benefits of lower cost and faster time to market as compared t...

09/18/2017

IEEE-Phoenix Section, EP (formerly known as CPMT) Society Chapter

Second lecture this month is on Sept. 27, 2017 on Advancement in High Density Fan-Out and Heterogeneous Integration by Mr. Curtis Zwenger from Amkor Technology

An advanced high-density fan-out structure called Silicon Wafer Integrated Fan-out Technology (SWIFT®) incorporates conventional WLFO processes with leading-edge thin film patterning techniques to bridge the gap between TSV and traditional WLFO packages. The SWIFT methodology is designed to provide…

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Phoenix, AZ

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